Improved device for copper wire paying off

• Main Authors: YU WENHUI, CHEN TIENIU, WANG WEIDONG, BAI FUQUAN
• Format: Patent
• Language: Chinese; English
• Published: 16.03.2011
• Subjects: CONVEYING; HANDLING THIN OR FILAMENTARY MATERIAL; HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES; PACKING; PERFORMING OPERATIONS; STORING; TRANSPORTING

An improved device for copper wire paying off comprises an inner cylindrical frame body and an outer cylindrical frame body, wherein the bottom ends of the inner cylindrical frame body and the outer cylindrical frame body are welded together through a plurality of horizontal binding posts, and an upper disc of the inner cylindrical frame body is welded with two arc positioning devices with the same dimensional structure. During use, a copper wire coiled in a ring shape is sheathed on the inner cylindrical frame body. When the copper wire is dragged and paid off, the tip of the copper wire is first wound into the position between the two positioning devices from the peripheries of the positioning devices on the inner cylindrical frame body, and then connected with a traction device. The improved device for copper wire paying off has the following advantages: an obstacle arranged at the outer side of the copper wire coiled in the ring shape prevents the copper wire from loosening, straightens outs the paying of