Semiconductor packaging structure

• Main Authors: HUANG YANGDONG, DING YING, SHEN JUN, ZHU HUI
• Format: Patent
• Language: Chinese; English
• Published: 05.01.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a semiconductor packaging structure, which comprises a lead frame main body and a chip. The lead frame main body consists of at least one unit. Each frame main body unit is provided with a chip bearing table. A pin is arranged for being matched with the chip bearing table. One end of the pin is provided with a welding part. The pin is connected with the chip bearing table by a connecting structure. Adjacent units are also connected by the connecting semiconductor packaging structure structures. The chip is arranged on the chip bearing table and is packaged by packaging resin. The semiconductor packaging structure is characterized by also comprising a copper sheet elastic clip, wherein one end of the sheet elastic clip is connected with the lead frame main body by an adhesive, while the other end thereof is connected with the chip by the adhesive. In the utility model, a connection clip is arranged and both ends of the connection clip are respectively connected with a lead fame and