Radiating and packaging structure of lead frame

The utility model discloses a radiating and packaging structure of a lead frame. The radiating and packaging structure comprises the lead frame and a radiating fin and is characterized in that through holes are arranged at the periphery of the lead frame; the radiating fin is provided with bumps mat...

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Bibliographic Details
Main Authors HUANG YANGDONG, DING YING, ZHU HUI, SHEN JUN
Format Patent
LanguageChinese
English
Published 10.11.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model discloses a radiating and packaging structure of a lead frame. The radiating and packaging structure comprises the lead frame and a radiating fin and is characterized in that through holes are arranged at the periphery of the lead frame; the radiating fin is provided with bumps matched with the through holes; and the lead frame and the radiating fin are in the stamping and clamping connection with the bumps by the through holes. The through holes and the bumps are arranged on the lead frame and the radiating fin respectively, and the lead frame and the radiating fin are in the stamping and clamping connection with the bumps by the through holes, thereby realizing the physics joint of the lead frame and the radiating fin and the high radiating efficiency and saving the cost.
Bibliography:Application Number: CN20102141575U