Polymer dielectrics for memory element array interconnect

Disclosed are semiconductor devices (100) containing a polymer dielectric (103) and at least one active device (104) containing an organic semiconductor material (112) and a passive layer (114). Also disclosed are semiconductor devices (100) further containing a conductive polymer (106 and/or 108)....

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Bibliographic Details
Main Author LYONS CHRISTOPHER F
Format Patent
LanguageEnglish
Published 11.07.2007
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Summary:Disclosed are semiconductor devices (100) containing a polymer dielectric (103) and at least one active device (104) containing an organic semiconductor material (112) and a passive layer (114). Also disclosed are semiconductor devices (100) further containing a conductive polymer (106 and/or 108). Such devices are characterized by light weight and robust reliability.
Bibliography:Application Number: CN200580017617