Apparatus and method for arranging devices for processing

• Main Author: CHENG CHI WAH,TANG HOI SHUEN JOSEPH,MAK TIM WAI TONY,CHAN SEE LOK
• Format: Patent
• Language: English
• Published: 20.06.2007
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MACHINE TOOLS; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PHYSICS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TESTING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention provides an apparatus for arranging for processing a semiconductor device having surface components on its surface. The apparatus includes a device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.