Magnetron sputter electrode and sputtering apparutus using the magnetron sputter electrode

• Main Author: LEE SANG HO,KOMATSU TAKASHI,NAKAMURA HAJIME,ARAI MAKOTO,KIYOTA JUNYA,TANI NORIAKI
• Format: Patent
• Language: English
• Published: 13.06.2007
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The content of this invention: magnetron sputter electrode enable simply contour regulation of tubular magnet beam generate between magnet assembly parts and easy to operate. A center magnet and peripheral magnets are arranged on the support plate, tubular magnet beam magnet assembly parts in front of target are consisted. The support plate including a center magnet and peripheral magnets is devided relative to two sides, center part fixed with a base plate, other divided parts are moved relative to centre part in direction of front and back, left and right, up and down by position change apparutus which arranged on the base plate.