Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device and electronic device using multilayer wiring board

• Main Author: SUGAYA YASUHIRO,YAMAMOTO YOSHIYUKI,ASAHI TOSHIYUKI,MIKI KATSUMASA,KATSUMATA MASAAKI,SAITOU YOSHIYUKI,NAKAYAMA TAKESHI
• Format: Patent
• Language: English
• Published: 06.06.2007
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A multilayer wiring board is provided with a plurality of wiring boards which include a plurality of wiring layers including a grounding layer and a power supply layer; a solid electrolytic capacitor wherein an insulating oxide film layer, an electrolyte layer and a conductive layer are successively formed on one plane or both planes of a foil-like metal base body; and a conductive member penetrating in a thickness direction of the wiring boards. The solid electrolytic capacitor is arranged to be sandwiched between the wiring boards, the conductive layer is connected to a grounding electrode formed on the grounding layer, and the foil-like metal base body is connected to a power supply electrode formed on the power supply layer.