Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device and electronic device using multilayer wiring board

A multilayer wiring board is provided with a plurality of wiring boards which include a plurality of wiring layers including a grounding layer and a power supply layer; a solid electrolytic capacitor wherein an insulating oxide film layer, an electrolyte layer and a conductive layer are successively...

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Main Author SUGAYA YASUHIRO,YAMAMOTO YOSHIYUKI,ASAHI TOSHIYUKI,MIKI KATSUMASA,KATSUMATA MASAAKI,SAITOU YOSHIYUKI,NAKAYAMA TAKESHI
Format Patent
LanguageEnglish
Published 06.06.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A multilayer wiring board is provided with a plurality of wiring boards which include a plurality of wiring layers including a grounding layer and a power supply layer; a solid electrolytic capacitor wherein an insulating oxide film layer, an electrolyte layer and a conductive layer are successively formed on one plane or both planes of a foil-like metal base body; and a conductive member penetrating in a thickness direction of the wiring boards. The solid electrolytic capacitor is arranged to be sandwiched between the wiring boards, the conductive layer is connected to a grounding electrode formed on the grounding layer, and the foil-like metal base body is connected to a power supply electrode formed on the power supply layer.
Bibliography:Application Number: CN200680000369