LED component and method for manufacturing same

An LED component is provided with a wiring board having a through hole at a center portion, a heat sink stored inside the through hole, an LED chip mounted on the heat sink, a connecting section for electrically connecting the LED chip with the wiring board, and a transparent resin for covering the...

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Main Author HASHIMOTO AKIRA,KATSUMATA MASAAKI,HAYAMA MASAAKI,ENDOU KENICHI,ENDOU KENJI,HIRANO HITOSHI,KATSUMURAHIDENORI,INOUE TATSUYA
Format Patent
LanguageEnglish
Published 06.06.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An LED component is provided with a wiring board having a through hole at a center portion, a heat sink stored inside the through hole, an LED chip mounted on the heat sink, a connecting section for electrically connecting the LED chip with the wiring board, and a transparent resin for covering the LED chip and the connecting section. The LED component efficiently dissipates heat of the LED chip and has excellent productivity.
Bibliography:Application Number: CN2006800435