Wet film coating process for flexible circuit board

The invention relates to a wet pasting method of flexible circuit board, wherein it comprises that: (1), heating copper foil at warm temperature at 45-65Deg. C; wetting, increasing the temperature, and forming worm water film on face; (2), feeding copper foil into pasting machine; (3); pasting machi...

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Bibliographic Details
Main Author ZHENHUI,YU CAO
Format Patent
LanguageEnglish
Published 23.05.2007
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The invention relates to a wet pasting method of flexible circuit board, wherein it comprises that: (1), heating copper foil at warm temperature at 45-65Deg. C; wetting, increasing the temperature, and forming worm water film on face; (2), feeding copper foil into pasting machine; (3); pasting machine pastes film on the face with warm water film. The invention can reduce viscosity and increase flow property, to make the connection between film and copper foil stable and integral.
Bibliography:Application Number: CN20051101656