Chemically amplified resist composition and method for forming resist pattern

The invention provides a chemically amplified resist composition containing a resin component (A) exhibiting the solubility in an alkali which is changed by the reaction with an acid and an acid-generating agent component (B), which further comprises a high boiling point solvent component (X) having...

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Bibliographic Details
Main Author SHIMBORI HIROSHI
Format Patent
LanguageEnglish
Published 16.05.2007
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:The invention provides a chemically amplified resist composition containing a resin component (A) exhibiting the solubility in an alkali which is changed by the reaction with an acid and an acid-generating agent component (B), which further comprises a high boiling point solvent component (X) having a boiling point of 220 DEG C or higher.
Bibliography:Application Number: CN200580018940