LED chip

A LED chip is prepared as setting the first doped semiconductor layer on base plate and luminous layer between the first and the second doped semiconductor layers, setting AlGa nitride material layer doped with In on one surface of luminous layer and tunneling joint layer between AlGa nitride materi...

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Bibliographic Details
Main Author LIANGWEN,JIAN WU
Format Patent
LanguageEnglish
Published 02.05.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A LED chip is prepared as setting the first doped semiconductor layer on base plate and luminous layer between the first and the second doped semiconductor layers, setting AlGa nitride material layer doped with In on one surface of luminous layer and tunneling joint layer between AlGa nitride material layer doped with In and the first doped semiconductor layer, arranging AlGa nitride material layer doped with In and tunneling joint layer at the same side of luminous layer.
Bibliography:Application Number: CN20051114474