Saw for semiconductor device

Improved systems and methods for singulating a substrate into a plurality of integrated circuit devices are disclosed. One aspect of the invention corresponds to a fixture that holds the substrate during the dicing process. Another aspect of the invention pertains to a nozzle assembly that provides...

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Bibliographic Details
Main Author MIHIA CHRIS,KHOR TEANG K.,DONKER MARCUS F.,GEMERTLEONARDUS A
Format Patent
LanguageEnglish
Published 11.04.2007
Subjects
BROACHING
COMPONENTS OR ACCESSORIES THEREFOR
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
FILING
GRINDING
LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR
MACHINE TOOLS
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
METAL-WORKING NOT OTHERWISE PROVIDED FOR
NAILING OR STAPLING MACHINES IN GENERAL
PERFORMING OPERATIONS
PLANING
POLISHING
SAWING
SAWS FOR WOOD OR SIMILAR MATERIAL
SCRAPING
SHEARING
SLOTTING
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:Improved systems and methods for singulating a substrate into a plurality of integrated circuit devices are disclosed. One aspect of the invention corresponds to a fixture that holds the substrate during the dicing process. Another aspect of the invention pertains to a nozzle assembly that provides better fluid flow over the cutting blades. Another aspect of the invention corresponds to a nozzle adjustment assembly that helps position the nozzles relative to the blades. Another aspect of the invention corresponds to spacers that reduce the problem of imbalance caused by fluid retained therein. Yet another aspect pertains to the composition of the fluid, which is distributed by the nozzle assembly to the blades.
Bibliography:Application Number: CN200580012639