Wiring board and semiconductor device

• Main Author: TANIDA KAZUMASA,MIYATA OSAMU
• Format: Patent
• Language: English
• Published: 04.04.2007
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The invention provides a wiring board ( 2,15 ) to which a semiconductor chip ( 3 ) is to be bonded while directing a surface of the semiconductor chip toward the wiring board. The wiring board includes a connection electrode ( 14 ) that is formed on a bonding surface ( 2 a , 15 a) to which the semiconductor chip is to be bonded and that is used to make a connection with the semiconductor chip, an insulating film ( 6 ) that is formed on the bonding surface and that has an opening ( 6 a) to expose the connection electrode, and a low-melting-point metallic part ( 16 ) that is provided on the connection electrode in the opening and that is made of a low-melting-point metallic material whose solidus temperature is lower than that of the connection electrode.