Wiring board and semiconductor device

The invention provides a wiring board ( 2,15 ) to which a semiconductor chip ( 3 ) is to be bonded while directing a surface of the semiconductor chip toward the wiring board. The wiring board includes a connection electrode ( 14 ) that is formed on a bonding surface ( 2 a , 15 a) to which the semic...

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Bibliographic Details
Main Author TANIDA KAZUMASA,MIYATA OSAMU
Format Patent
LanguageEnglish
Published 04.04.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The invention provides a wiring board ( 2,15 ) to which a semiconductor chip ( 3 ) is to be bonded while directing a surface of the semiconductor chip toward the wiring board. The wiring board includes a connection electrode ( 14 ) that is formed on a bonding surface ( 2 a , 15 a) to which the semiconductor chip is to be bonded and that is used to make a connection with the semiconductor chip, an insulating film ( 6 ) that is formed on the bonding surface and that has an opening ( 6 a) to expose the connection electrode, and a low-melting-point metallic part ( 16 ) that is provided on the connection electrode in the opening and that is made of a low-melting-point metallic material whose solidus temperature is lower than that of the connection electrode.
Bibliography:Application Number: CN200580011697