Semiconductor chip, display panel using the same, and methods of manufacturing semiconductor chip and display panel using the same

A semiconductor chip and manufacturing method thereof, the semiconductor chip including a plurality of bumps connected to a driving circuit integrated on a semiconductor substrate and an organic insulating layer disposed on the driving circuit. The organic insulating layer extends from the semicondu...

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Bibliographic Details
Main Author CHO WON G.,KANG HO M
Format Patent
LanguageEnglish
Published 28.02.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor chip and manufacturing method thereof, the semiconductor chip including a plurality of bumps connected to a driving circuit integrated on a semiconductor substrate and an organic insulating layer disposed on the driving circuit. The organic insulating layer extends from the semiconductor substrate less than the plurality of bumps such that a lower edge of the plurality of bumps protrudes further than a lower edge of the organic insulating layer.
Bibliography:Application Number: CN200610121558