Optoelectronic assembly with heat sink

• Main Authors: DUNN MARK J, MEADOWCROFT DAVID J. K
• Format: Patent
• Language: Chinese; English
• Published: 06.04.2011
• Subjects: ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; TRANSMISSION

An optoelectronic assembly having a heat sink, and in particular to an optical receiver or transmitter unit for use in an optical fibre communication system in which a heat sink is provided to carry away heat generated by electrical components within the unit. The optoelectronic assembly 60 comprises an optical transceiver unit 101, a heat sink 30 and a housing 46, 48. The optical transceiver unit 101 is accommodated in the housing 46, 48. The optical transceiver unit 101 has an interior containing at least one optoelectronic device 14 with at least one electrical connection to said device 14for providing electrical power to the device, the electrical connection being made through an electrical contact 112 on an external surface 110 of the optical transceiver unit 101. The heat sink 30 is mounted to the optical transceiver unit 101 and is in thermal contact with both the optical transceiver unit 101 and the housing 46, 48 to convey waste heat 54 from within the optical transceiver unit 101 to the housing 46,