Process for fabricating chip resistor

• Main Author: KOBAYASHI KYOJI,OGUCHI TOMONORI
• Format: Patent
• Language: English
• Published: 21.02.2007
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRICITY; RESISTORS

A process for fabricating a chip resistor capable of forming an end face electrode easily with high accuracy even if the overall dimensions are reduced, comprising a step for forming surface and rear surface electrodes corresponding to individual chip areas, a resistor and a protective film collectively on a large-size substrate , a step for applying an upper protective layer and a lower protective layer to the surface and rear surface of the large-size substrate , and a step for securing the large-size substrate onto a supporting base through the lower protective layer . The process further comprises a step for making a plurality of primary slits in parallel with each other in the large size substrate by dicing, a step for forming an end face electrode bridging the surface electrode exposed in the primary slit and the end face of the rear surface electrode by sputtering, a step for making a plurality of secondary slits intersecting the primary slits perpendicularly by dicing, a step for subdividing the large-size substrate into multiple chip units , a step for stripping from the supporting base each chip unit by cleaning the upper protective layer and a lower protective layer , and a step for forming a plating layer on the underlying electrode layer of each chip unit to obtain a completed product of a chip resistor .