Method of fabricating a resistance based memory device and the memory device

Example embodiments relate to a method of fabricating a memory device and a memory device. The method of fabricating a memory device comprises forming a lower electrode and an oxide layer on a lower structure and radiating an energy beam on a region of the oxide layer. The memory device comprises a...

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Bibliographic Details
Main Author AHN SEUNG-EON,KIM HYE-YOUNG,PARK BYOUNG-HO,YUN JUNG-BIN,KIM YOU-SEON
Format Patent
LanguageEnglish
Published 14.02.2007
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Summary:Example embodiments relate to a method of fabricating a memory device and a memory device. The method of fabricating a memory device comprises forming a lower electrode and an oxide layer on a lower structure and radiating an energy beam on a region of the oxide layer. The memory device comprises a lower structure and an oxide layer and a lower structure formed on the lower structure, the oxide layer including an electron beam radiation region that received radiation from an electron beam source creating an artificially formed current path through the oxide layer to the lower electrode. A reset current of the memory device may be decreased and stabilized.
Bibliography:Application Number: CN200610110772