Method for adhering getter material to a surface for use in electronic devices

• Main Author: TREMEL JAMES D.,HUBERT MATTHEW D.,CARDELLINO TERRI,CHO YONG
• Format: Patent
• Language: English
• Published: 10.01.2007
• Subjects: APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; BLASTING; CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; DRYING; DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEATING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; LIGHTING; MECHANICAL ENGINEERING; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; THEIR RELEVANT APPARATUS; TRANSPORTING; WEAPONS

Disclosed is a method of adhering a getter material to a surface, wherein the getter is used to remove and control contaminant gases in the environment surrounding the active layers in an electronic device. The getter material is applied from a getter composition comprising getter particles, inorganic binders and a liquid medium to create a composition of a consistency that can be deposited on the surface in any pattern and in any thickness desired. The surface on which the getter composition is deposited can be heated separately from the electronic device so as to activate the getter material and cause the particles to adhere to the surface without the need of additional adhesive layers or other materials.