Supercritical fluid-based cleaning compositions and methods

• Main Author: ROEDER JEFFREY F.,BAUM THOMAS H.,HEALY MATTHEW,XUCHONGYING
• Format: Patent
• Language: English
• Published: 10.01.2007
• Subjects: ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES; APPARATUS SPECIALLY ADAPTED THEREFOR; BLEACHING LEATHER OR FURS; CANDLES; CHEMISTRY; CINEMATOGRAPHY; CLEANING; CLEANING IN GENERAL; DETERGENT COMPOSITIONS; DETERGENTS; DRY-CLEANING, WASHING OR BLEACHING FIBRES, FILAMENTS, THREADS,YARNS, FABRICS, FEATHERS OR MADE-UP FIBROUS GOODS; ELECTROGRAPHY; FATTY ACIDS THEREFROM; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR; HOLOGRAPHY; LAUNDERING; MATERIALS THEREFOR; METALLURGY; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PREVENTION OF FOULING IN GENERAL; RECOVERY OF GLYCEROL; RESIN SOAPS; SOAP OR SOAP-MAKING; TEXTILES; TRANSPORTING; TREATMENT OF TEXTILES OR THE LIKE; USE OF SINGLE SUBSTANCES AS DETERGENTS

Compositions and methods employing supercritical fluids, e.g., supercritical carbon dioxide, for removal of unwanted material from microelectronic device structures and process equipment. One composition of such type, having utility for removing flux and solder perform surface films, includes supercritical fluid, e.g., supercritical CO2, and organic co-solvent, e.g., xylene. Another composition of such type having utility for removal of metals, metal oxides, metal-containing post-etch residues and CMP particles from semiconductor substrates includes supercritical fluid and at least one beta-diketone.