Normal temperature bonding method for quartz microflow control chip and pressurizing mould

• Main Author: ZHONGPENG,MA DAI
• Format: Patent
• Language: English
• Published: 10.01.2007
• Subjects: CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; GLASS; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; JOINING GLASS TO GLASS OR OTHER MATERIALS; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES; MEASURING; METALLURGY; MINERAL OR SLAG WOOL; PHYSICS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; TESTING

This invention provides a chip bonding method and a pressing mould used in normal temperature quick sealing for manufacturing quartz micro-fluidic chips, which processes two pieces of quartz chips to be sealed with rare HF acid in the mass percentage concentration of 0.1-1%, the process time of 2-3 minutes and presses them by a pressing mould in the sphere of 0.5MPa-2MPa to be heated for a period of time in an oven under 50-150deg.C for 1-2 hours to realize large area of sealing of chips, said mould includes an upper pressing board, a lower pressing board opposite and parallel to the upper one and a lifting screw rod, two quartz chips to be sealed are placed on the lower pressing board and a lifting screw rod opposite to the chip is set on the bottom of the upper pressing board.