Laminate-cutting method, cutting device, and laminate-cutting pedestal

• Main Author: TANAKA YOSHIKAZU,NISHIKUBO TOSHIROU,KITADA KAZUO,HARA NORIAKI,SUTOU SADAJI
• Format: Patent
• Language: English
• Published: 29.11.2006
• Subjects: CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING; HAND CUTTING TOOLS; PERFORMING OPERATIONS; SEVERING; TRANSPORTING

The laminate-cutting method according to the present invention is a method for cutting an optical film wherein layers are laminated through a pressure-sensitive adhesive agent with a cutting edge, wherein the cutting of the laminate with the cutting edge is performed in the state that compressive st...