Laminate-cutting method, cutting device, and laminate-cutting pedestal

The laminate-cutting method according to the present invention is a method for cutting an optical film wherein layers are laminated through a pressure-sensitive adhesive agent with a cutting edge, wherein the cutting of the laminate with the cutting edge is performed in the state that compressive st...

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Bibliographic Details
Main Author TANAKA YOSHIKAZU,NISHIKUBO TOSHIROU,KITADA KAZUO,HARA NORIAKI,SUTOU SADAJI
Format Patent
LanguageEnglish
Published 29.11.2006
Subjects
CUTTING
DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING
HAND CUTTING TOOLS
PERFORMING OPERATIONS
SEVERING
TRANSPORTING
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Summary:The laminate-cutting method according to the present invention is a method for cutting an optical film wherein layers are laminated through a pressure-sensitive adhesive agent with a cutting edge, wherein the cutting of the laminate with the cutting edge is performed in the state that compressive stress applied to the optical film is decreased when the laminate is cut with the cutting edge. This makes it possible to provide a laminate-cutting method, a cutting device and a laminate-cutting pedestal wherein the generation of the adhesion of paste to a cutting edge, the blocking, cracking, chipping of cut faces, and others is prevented.
Bibliography:Application Number: CN200510073979