Light emitting device package and method for manufacturing the same
The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light emitting device is electrically connected to other devices without use of wire bonding, thereby saving a space for wire bonding and reducing...
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
22.11.2006
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light emitting device is electrically connected to other devices without use of wire bonding, thereby saving a space for wire bonding and reducing the size of a package. The present invention has advantages in that there is no wire in a light emitting device by using a conductive interconnection portion so that a phosphor can be easily and uniformly applied, and an area where vertically emitted light is absorbed can be reduced so that light extraction of a device can be enhanced. |
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| AbstractList | The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light emitting device is electrically connected to other devices without use of wire bonding, thereby saving a space for wire bonding and reducing the size of a package. The present invention has advantages in that there is no wire in a light emitting device by using a conductive interconnection portion so that a phosphor can be easily and uniformly applied, and an area where vertically emitted light is absorbed can be reduced so that light extraction of a device can be enhanced. |
| Author | KIM GEUN H.,LEE SEUNG Y |
| Author_xml | – fullname: KIM GEUN H.,LEE SEUNG Y |
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| Notes | Application Number: CN200610084053 |
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| PublicationDate | 20061122 |
| PublicationDateYYYYMMDD | 2006-11-22 |
| PublicationDate_xml | – month: 11 year: 2006 text: 20061122 day: 22 |
| PublicationDecade | 2000 |
| PublicationYear | 2006 |
| RelatedCompanies | LG INNOTEK CO., LTD |
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| Snippet | The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Light emitting device package and method for manufacturing the same |
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