Light emitting device package and method for manufacturing the same

The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light emitting device is electrically connected to other devices without use of wire bonding, thereby saving a space for wire bonding and reducing...

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Bibliographic Details
Main Author KIM GEUN H.,LEE SEUNG Y
Format Patent
LanguageEnglish
Published 22.11.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light emitting device is electrically connected to other devices without use of wire bonding, thereby saving a space for wire bonding and reducing the size of a package. The present invention has advantages in that there is no wire in a light emitting device by using a conductive interconnection portion so that a phosphor can be easily and uniformly applied, and an area where vertically emitted light is absorbed can be reduced so that light extraction of a device can be enhanced.
Bibliography:Application Number: CN200610084053