Method of manufacturing surface acoustic wave device which prevents sticking of foreign matters

• Main Author: KUDO TAKUO,IKEDA TAKESHI,SATO TAKASHI,OZAKI KYOSUKE,MATSUO YUTAKA,MEGURO TOSHIHIRO
• Format: Patent
• Language: English
• Published: 18.10.2006
• Subjects: BASIC ELECTRONIC CIRCUITRY; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS

The manufacturing method of a surface acoustic wave device uses the steps of (a) providing interdigitial transducers (2) and reflectors (5a,5b) on a substrate (1) (b) providing a protective conductor (12) on the substrate outside the area of the interdigitial transducers and/or the reflectors (c) providing a protective SiO-layer (6) which protects interdigital transducers and reflectors from contaminants and other foreign matter (d) providing a conductor layer (4) for connecting to the electrode sections (3a,3b) of the interdigital electrodes (e) removing the protective conductor (12), e.g. by chemical etching This manufacturing methods prevents pyroelectric damage during the intermediate steps of the procedure. This is particularly useful when fabricating a ladder-type filter on a single substrate.