Method for reducing freeze-thaw voids in incured adhesives
A method for reducing the level of freeze-thaw voids in an uncured adhesive subjected to freezing and thawing comprises storing the adhesive in a container in which the walls of the container are a thermoplastic material and have been thinned and roughened.
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Main Author | |
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Format | Patent |
Language | English |
Published |
04.10.2006
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Subjects | |
Online Access | Get full text |
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Summary: | A method for reducing the level of freeze-thaw voids in an uncured adhesive subjected to freezing and thawing comprises storing the adhesive in a container in which the walls of the container are a thermoplastic material and have been thinned and roughened. |
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Bibliography: | Application Number: CN200510069784 |