Method for controlling the formation of the trailing shield gap during perpendicular head fabrication and head formed thereby
A method for controlling the formation of the trailing shield gap during perpendicular head fabrication and head formed thereby are disclosed. The in-situ trailing shield gap deposition process removes the pre-sputter process that can damage the write pole material. Further, a seed pre-layer is form...
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Main Author | |
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Format | Patent |
Language | English |
Published |
23.08.2006
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Subjects | |
Online Access | Get full text |
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Summary: | A method for controlling the formation of the trailing shield gap during perpendicular head fabrication and head formed thereby are disclosed. The in-situ trailing shield gap deposition process removes the pre-sputter process that can damage the write pole material. Further, a seed pre-layer is formed on top of the trailing shield gap to absorb any non-uniformity of the trailing shield gap and to control issues resulting from the pre-sputter process originating from the trailing shield seed deposition. |
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Bibliography: | Application Number: CN200610005722 |