A substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same

A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90 % by weight of spherical filler.

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Bibliographic Details
Main Author YAMANO TAKAHARU,ARAI TADASHI,MACHIDA YOSHIHIRO
Format Patent
LanguageEnglish
Published 16.08.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90 % by weight of spherical filler.
Bibliography:Application Number: CN200510131558