Power module,Phase leg,And three-phase inverter

• Main Author: STEVANOVIC LJUBISA D.,DELGADO ELADIO C.,SCHUTTEN MICHAEL J.,BEAUPRE RICHARD A.,DE ROOIJ MICHAEL A
• Format: Patent
• Language: English
• Published: 05.07.2006
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A power module (10) includes a substrate (12) that includes an upper layer (16), an electrical insulator and a thermal coupling layer. The upper layer includes an electrically conductive pattern (17) and is configured for receiving power devices (14). The electrical insulator is disposed between the upper layer and the thermal coupling layer. The thermal coupling layer is configured for thermal coupling to a heat sink. The power module further includes at least one laminar interconnect (18) that includes first and second electrically conductive layers (20, 24) and an insulating layer (22) disposed between the first and second electrically conductive layers. The first electrically conductive layer of the laminar interconnect is electrically connected to the upper layer of the substrate. Electrical connections (42) connect a top side (19) of the power devices to the second electrically conductive layer of the laminar interconnect.