Wiring board manufacturing method

• Main Author: SHITO KISHI,KONO KENJI,HANDA KENJI,ABE KENICHIRO,ARAI KEIJI,SEYAMA KIYOTAKA
• Format: Patent
• Language: English
• Published: 10.05.2006
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A wiring board manufacturing method for manufacturing a wiring board by separately fabricating a build-up layer having a wiring pattern formed with an insulating layer interposed therebetween and a core sheet and combining the build-up layer and the core sheet. The build-up layer is formed on a plate support separably from the support. The core sheet is electrically connected to the wiring pattern formed on the build-up layer and bonded to the build-up layer formed on the support. The support is separated from the build-up layer, thus fabricating a wiring board where the build-up layer is bonded to the core sheet. By thus separately fabricating the build-up layer and the core sheet, a wiring board effectively exhibiting the characteristics of the build-up layer and the core sheet can be produced.