Releasable adhesive composition

• Main Author: KIM JANG-SOON,KIM WOO-HA,LEE JAE-GWAN,CHANG SUK-KEE,KIM WOOK,LEE GEUN-HEE,LEE BYOUNG-SOO
• Format: Patent
• Language: English
• Published: 10.05.2006
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; COMPOSITIONS BASED THEREON; DYES; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

The present invention provides an adhesive composition comprising an adhesive polymer resin and an organic crystalline material having a higher melting point than the maximum acceptable operating temperature of products where the adhesive is used, as well as an adhesive sheet prepared therefrom. The adhesive composition and adhesive sheet of the present invention maintain excellent adhesion strength at their use temperature and show a rapid reduction in adhesion at a higher temperature than the melting point of the organic crystalline material so as to allow release from substrates.