Halogen-free flame-retardant resin composition and prepreg and laminate using the same
The present invention relates to a halogen-free flame-retardant resin composition and a prepreg and a copper clad laminate using the same. The present invention provides a halogen-free flame-retardant resin composition comprising a polyphosphate compound as phosphorus-based flame retardant and a pre...
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Main Author | |
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Format | Patent |
Language | English |
Published |
26.04.2006
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a halogen-free flame-retardant resin composition and a prepreg and a copper clad laminate using the same. The present invention provides a halogen-free flame-retardant resin composition comprising a polyphosphate compound as phosphorus-based flame retardant and a prepreg and a copper clad laminate using the same. The resin composition of the present invention has superior flame retardancy without using a halogen-based flame retardant. Also, because it has superior heat resistance, a high glass transition temperature (Tg), good copper peeling strength and superior lead heat resistance after moisture absorption, it can be utilized in a copper clad laminate for printed circuit boards, etc. |
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Bibliography: | Application Number: CN200580000091 |