Printed circuit board having chip package mounted theron and method of fabricating same
Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded...
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Main Author | |
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Format | Patent |
Language | English |
Published |
22.03.2006
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Subjects | |
Online Access | Get full text |
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Summary: | Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer. |
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Bibliography: | Application Number: CN200510063532 |