Organic matter vaporization plating device

• Main Author: SONG KWAN-SOP,KIM TU-KVN,AN JAE-HONG,KANG HIOL,CHUNG SOK-SON
• Format: Patent
• Language: English
• Published: 08.03.2006
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide an organic matter vapor deposition system by which, in a state where a substrate is almost vertically stood, organic matter is vapor-deposited, so as to form an organic thin film, and which is applicable to a large-sized substrate, and can form an organic thin film with a uniform thickness as well. The organic matter vapor deposition system is equipped with: a chamber forming a barrel body and allowing a substrate to retain an angle from 70 to 110[deg.] to the ground; an organic matter storage section composed of at least one organic matter storage part receiving the organic matterto be vapor-deposited on the substrate; an organic matter injection nozzle section of injecting the organic matter to be vapor-deposited on the substrate; a connection line of connecting the organic matter injection nozzle section and the organic matter storage section; and a transfer device capable of moving at least the organic matter injection nozzle section among the organic matter storage section, the organic matter injection nozzle section and the connection line to a vertical direction.