Method for conducting production processes of fixed wafer

A method for fixing chip in order to make convenience for chip fabrication includes providing a chip with the first and the second surfaces , a handling carrier and a thermal release tape ; sticking thermal release tape between the first surface and handling carrier for fixing chip on said carrier ;...

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Bibliographic Details
Main Author XINYA,HE PENG
Format Patent
LanguageEnglish
Published 01.03.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for fixing chip in order to make convenience for chip fabrication includes providing a chip with the first and the second surfaces , a handling carrier and a thermal release tape ; sticking thermal release tape between the first surface and handling carrier for fixing chip on said carrier ; carrying out fabricating process on the second surface ; separating thermal release tape , the first surface and handling carrier to each other by applying certain temperature .
Bibliography:Application Number: CN2004168532