Method for producing transistor and semiconductor device circuit
PURPOSE:To improve throughput by making an active region of a crystalline silicon film formed on a substrate have a catalytic element promoting more than specific crystallization and making concentration of a catalytic element of an impurity region adjacent to the active region larger than that of t...
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Main Author | |
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Format | Patent |
Language | English |
Published |
01.03.2006
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE:To improve throughput by making an active region of a crystalline silicon film formed on a substrate have a catalytic element promoting more than specific crystallization and making concentration of a catalytic element of an impurity region adjacent to the active region larger than that of the active region. CONSTITUTION:A foundation film 11 of silicon oxide is formed on a substrate 10 by sputtering. Next, an amorphous silicon film is piled up to crystallize. Later, the silicon film is patterned so as to form an insular silicon region 12. Further, a silicon oxide film 14 is piled up as a gate insulating film. Then, the silicon film is patterned so as to form a gate electrode 15. Next, the silicon oxide film 14 is etched so as to activate the impurity regions 16a, 16b to crystallize. At this time, a catalytic element for crystallization is made to have larger concentration than the concentration 1X10 cm of the active region of a crystalline silicon film. Thereby, crystallization time can be shortened. |
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Bibliography: | Application Number: CN2005191919 |