Ball grid array package structure and its base plate

Disclosed a packing structure of ball grating array (BGA), comprises a baseboard and a chip. Wherein, one lower surface of said base board has a center region and a surrounding region, while a plurality of power source balls are arranged in the center region and several groups of balls, which at lea...

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Bibliographic Details
Main Author YONGHAN CHEN
Format Patent
LanguageEnglish
Published 22.02.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed a packing structure of ball grating array (BGA), comprises a baseboard and a chip. Wherein, one lower surface of said base board has a center region and a surrounding region, while a plurality of power source balls are arranged in the center region and several groups of balls, which at least has a earthing ball and at most three signal balls, are arranged in the surrounding region; said chip is arranged on the top surface of this base board and is electrical connected to the base board. The invention corrects the defects of noise or abnormal operation coursed by lack of earthing balls in the packaging structure of ball grating array, as well as provides a baseboard of this packaging structure.
Bibliography:Application Number: CN2005189431