Welding agent for braze, braze method and printing substrate

PROBLEM TO BE SOLVED: To provide a flux for soldering in which the preservation stability of the flux is increased, a soldering method using the same and a printed board. SOLUTION: The flux contains a resin having film forming ability, an activator and a solvent and is used when soldering is perform...

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Bibliographic Details
Main Author IKEDA IKKI,IRI HISAO,SHIMA TOSHINORI,ANADA RYUAKI,ISHIKAWA TOSHISUKE
Format Patent
LanguageEnglish
Published 22.02.2006
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To provide a flux for soldering in which the preservation stability of the flux is increased, a soldering method using the same and a printed board. SOLUTION: The flux contains a resin having film forming ability, an activator and a solvent and is used when soldering is performed on the printed board to which electroless nickel plating is applied. The flux contains organic acid metallic salt of 0.1-20 wt.% to the total amount of the flux and, the activator is the same organic acid as an organic acid which comprises the organic acid metallic salt or an organic acid which is lower than it in acidity. Thus, the stability of the organic acid metallic salt is increased and high joining strength is maintained for a long term. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: CN200410097315