Electricity conductive liquid capable of directly galvanizing the printed board

The conductive liquid to plate directly the printed board comprises graphite 2-5%, Na2SiO3 0.5-1%, anionic surface active agent 0.5-2%, NH4OH 2-4% and water 88-96%. The product has advantages: 1. well stability. There is no hydrogen separated out during absorption to copper covered plate to ensure l...

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Bibliographic Details
Main Author GUISHENG,LI LU
Format Patent
LanguageEnglish
Published 15.02.2006
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:The conductive liquid to plate directly the printed board comprises graphite 2-5%, Na2SiO3 0.5-1%, anionic surface active agent 0.5-2%, NH4OH 2-4% and water 88-96%. The product has advantages: 1. well stability. There is no hydrogen separated out during absorption to copper covered plate to ensure layer interlinkage quality; there is no chemical reaction to consume other constituents; thereby, it needs not to analyze and adjust solution to add fresh liquid for real production; 2. it is convenient to operate and maintenance and reliable; 3. it saves labor and time, controls effectively the waste water discharge, and decreases consumption and cost.
Bibliography:Application Number: CN2004120222