Electronic component mounting apparatus

• Main Author: KANO YOSHINORI,USUI YOSHINAO,TAKEMURA IKUO,MORIYAYUJI,YAMAGUCHI HARUHIKO,OKAMOTO MANABU,IZUHARA KOICHI,KURATA KENJI,ASAI JUN
• Format: Patent
• Language: English
• Published: 01.02.2006
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

The invention is directed to performing electronic component mounting operations by the suction nozzles of the mounting heads (8) in each of the plurality of the rotary tables (4A) independently, moving each of the positioning tables (4A) for positioning a printed board (Y) in a component mounting position independently, and performing the electronic component mounting operation on the plurality of the printed boards (Y) independently. A component feeding device moves a plurality of component feeding tables (12) having a plurality of component feeding units in an arraying direction thereof respectively and independently. Mounting heads (8) having a plurality of suction nozzles for picking up electronic components from the component feeding devices respectively are provided at predetermined intervals corresponding to intermittent pitches on an outer circumference of two rotary tables (7) intermittently rotating. Therefore, the suction nozzle of the mounting head (8) of each of the rotary tables (7) picks up the electronic component fed to a component pickup position in each of the component feeding units set on each of the component feeding tables (12), and mounts the component on the printed board (Y) on the corresponding positioning table (4A).