Method and apparatus for high volume assembly of radio frequency identification tags

• Main Author: ARNESON MICHAEL R.,BANDY WILLIAM R
• Format: Patent
• Language: English
• Published: 18.01.2006
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMBINED OPERATIONS; COMPUTING; COUNTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING RECORD CARRIERS; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OTHER WORKING OF METAL; PERFORMING OPERATIONS; PHYSICS; PRESENTATION OF DATA; PRINTED CIRCUITS; RECOGNITION OF DATA; RECORD CARRIERS; SEMICONDUCTOR DEVICES; TRANSPORTING; UNIVERSAL MACHINE TOOLS

A method for assembling a plurality of electronic devices is described. A plurality of dies separated die from a wafer are attached to a support surface. The plurality of dies is transferred from the support surface to a substrate structure that includes a plurality of tag substrates.