Method and apparatus for high volume assembly of radio frequency identification tags

A method for assembling a plurality of electronic devices is described. A plurality of dies separated die from a wafer are attached to a support surface. The plurality of dies is transferred from the support surface to a substrate structure that includes a plurality of tag substrates.

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Bibliographic Details
Main Author ARNESON MICHAEL R.,BANDY WILLIAM R
Format Patent
LanguageEnglish
Published 18.01.2006
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMBINED OPERATIONS
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING RECORD CARRIERS
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PRINTED CIRCUITS
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
TRANSPORTING
UNIVERSAL MACHINE TOOLS
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Summary:A method for assembling a plurality of electronic devices is described. A plurality of dies separated die from a wafer are attached to a support surface. The plurality of dies is transferred from the support surface to a substrate structure that includes a plurality of tag substrates.
Bibliography:Application Number: CN20038003483