Method and apparatus for high volume assembly of radio frequency identification tags
A method for assembling a plurality of electronic devices is described. A plurality of dies separated die from a wafer are attached to a support surface. The plurality of dies is transferred from the support surface to a substrate structure that includes a plurality of tag substrates.
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
18.01.2006
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A method for assembling a plurality of electronic devices is described. A plurality of dies separated die from a wafer are attached to a support surface. The plurality of dies is transferred from the support surface to a substrate structure that includes a plurality of tag substrates. |
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| AbstractList | A method for assembling a plurality of electronic devices is described. A plurality of dies separated die from a wafer are attached to a support surface. The plurality of dies is transferred from the support surface to a substrate structure that includes a plurality of tag substrates. |
| Author | ARNESON MICHAEL R.,BANDY WILLIAM R |
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| Snippet | A method for assembling a plurality of electronic devices is described. A plurality of dies separated die from a wafer are attached to a support surface. The... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBINED OPERATIONS COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR OTHER WORKING OF METAL PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED CIRCUITS RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES TRANSPORTING UNIVERSAL MACHINE TOOLS |
| Title | Method and apparatus for high volume assembly of radio frequency identification tags |
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