System for cleaning substrate

Disclosed is a system for cleaning a substrate such as a semiconductor wafer in wet type to thereby reduce airborne molecular contaminants (AMCs) in a wet station and a cleaning room by efficiently exhausting fumes generated during a wet cleaning process. The system for cleaning the substrate includ...

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Bibliographic Details
Main Author PARK HYUN-YUL,BAE JONG-KON
Format Patent
LanguageEnglish
Published 23.11.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:Disclosed is a system for cleaning a substrate such as a semiconductor wafer in wet type to thereby reduce airborne molecular contaminants (AMCs) in a wet station and a cleaning room by efficiently exhausting fumes generated during a wet cleaning process. The system for cleaning the substrate includes: a housing; a plurality of bathes placed inside of the housing; a transferring means placed on a top portion of the plurality of bathes for transferring a substrate; a first exhausting means connected to the plurality of bathes for exhausting fumes inside of the plurality of bathes; and a second exhausting means placed in a space inside of the housing and outside of the plurality of bathes for exhausting chemical fumes.
Bibliography:Application Number: CN200510070912