Slurry for cmp and method of polishing substrate using same

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Bibliographic Details
Main Author KIM DAE H.,HONG SEOK M.,JEON JAE H.,KIM HO S.,PARK HYUN S.,PAIK UN G.,PARK JAE G.,KIM YONG K
Format Patent
LanguageEnglish
Published 16.11.2005
Edition7
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
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Bibliography:Application Number: CN200510069987