Polishing composition

• Main Authors: TAKASHINA SHIGEAKI, HAGIHARA TOSHIYA, YOSHIDA HIROYUKI, HONMA YUICHI
• Format: Patent
• Language: Chinese; English
• Published: 10.08.2011
• Subjects: ADHESIVES; CHEMISTRY; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

The present invention relates to a polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from -15 to 40 mV; a method for manufacturing a substrate including the step of polishing a substrate to be polished with a polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from -15 to 40 mV; and a method for reducing scratches on a substrate to be polished with a polishing composition containing an aqueous medium and silica particles, including the step of adjusting a zeta potential of silica particles in the polishing composition to -15 to 40 mV. The polishing composition can be favorably used inpolishing the substrate for precision parts, including substrates for magnetic recording media such as magnetic discs, optical discs and opto-magnetic discs; photomask substrates; optical lenses; optical mirrors; optical pris