Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate

Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communicat...

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Bibliographic Details
Main Author GAUCHER BRIAN P.,LIU DUIXIAN,RUDOLF PFEIFFER ULLRICH R.,ZWICK THOMAS M
Format Patent
LanguageEnglish
Published 15.06.2005
Edition7
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
SEMICONDUCTOR DEVICES
WAVEGUIDES
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Summary:Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
Bibliography:Application Number: CN200410086092