Fluidic mems device

A MEMS package 1 comprises a substrate 3 and a cove plate 2. A MEMS structure 32 is fabricated on a surface 31 of the substrate. The cover plate 2 may be bonded to the substrate 3 by a bond ring 4. The cover plate 2, the bond ring 4 and the substrate 3 may define an inner cavity 11. The cover plate...

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Bibliographic Details
Main Authors BOUCHER WILLIAM R, HALUZAK CHARLES C, SMITH MARK A
Format Patent
LanguageEnglish
Published 09.02.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A MEMS package 1 comprises a substrate 3 and a cove plate 2. A MEMS structure 32 is fabricated on a surface 31 of the substrate. The cover plate 2 may be bonded to the substrate 3 by a bond ring 4. The cover plate 2, the bond ring 4 and the substrate 3 may define an inner cavity 11. The cover plate 2, the substrate 3 and a breach 42 in the bond ring 4 may define a fill port 111.
Bibliography:Application Number: CN200410043210